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D&R IP-SoC South Korea 2026
 

Agnisys is the Pioneer and Industry Leader in Golden Executable Specification Solutions™

Meet us at D&R IP-SoC South Korea 2026 and discover how we automate the entire path from specification to silicon.  

Schedule a meeting with our experts by completing the form on the right!

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September 15, 2026
Seoul, South Korea

Agnisys is exhibiting as a Silver Sponsor at D&R IP-SoC South Korea 2026, bringing together semiconductor IP providers, SoC designers, and industry leaders to explore the latest innovations in chip design. Visit us at Booth #17 to discover how Agnisys empowers engineering teams with specification-driven automation and agentic AI, accelerating semiconductor development from specification to sign-off.

Talk Session:

Title: Golden Specification Driven Chip Signoff with IDesignSpec-AI
Speaker: Anupam Bakshi, CEO & Founder

Discover how IDesignSpec-AI brings agentic AI to specification-driven chip design and signoff, enabling teams to automate RTL, verification, software, and documentation generation, maintain consistency and traceability, and identify specification issues earlier. By putting the specification at the center of the design flow, IDesignSpec-AI helps engineering teams accelerate development and achieve faster, more reliable Specification to Signoff with Agentic AI

Time: 02:30 PM
Visit: Room 2 

Explore live demonstrations of IDS-AI™ and IDS-NoC™, and discover how Agnisys is accelerating chip development from golden specification to sign-off through intelligent automation and Agentic AI.

Meet with Agnisys

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IDS-AI™: From Specification to Sign-Off, Dramatically Faster

Agnisys will demonstrate IDS-AI™, the industry’s first agentic AI framework purpose-built for semiconductor development. By combining advanced AI reasoning with Agnisys’ correct-by-construction methodology, IDS-AI helps engineering teams accelerate the journey from golden specification to sign-off.

IDS-AI covers critical stages of the IP-to-SoC development and verification flow, including:

  • Specification Checking & Verification – Validate specifications early, identify contradictions and gaps, and improve design accuracy before they become costly silicon issues.
  • Assertion Generation – Automatically generate SVA assertions to strengthen design verification, improve coverage, and support formal-ready verification.
  • Sequence Generation – Automatically generate UVM test sequences to simplify test development and reduce manual coding effort.
  • IP/SoC Sign-off – Streamline verification workflows and provide a connected path from specification through IP and SoC verification to sign-off.

 

IDS-NoC™: Scalable Network-on-Chip Automation

Agnisys will also showcase IDS-NoC™, a solution designed to eliminate one of the most significant bottlenecks in modern SoC development—building an interconnect fabric that scales efficiently for AI accelerators, automotive systems, and multi-core processors without the timing and integration limitations of traditional crossbar architectures.

Instead of manually designing routers and network interfaces, engineering teams can automatically generate a complete, deadlock-free NoC fabric with virtually unlimited scalability across instances and interconnect blocks. Because the generated RTL is provided as open, plain-text SystemVerilog rather than a black-box implementation, teams retain complete visibility and control over their IP. The result is reduced integration effort, faster time-to-market, and an interconnect architecture designed to support increasingly complex SoC designs.

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