DVCon India 2026
Agnisys is the Pioneer and Industry Leader in Golden Executable Specification Solutions™
Meet us at DVCon India 2026 and discover how we automate the entire path from specification to silicon.
Schedule a meeting with our experts by completing the form on the right!

September 1-3, 2026
Marathahalli, Bangalore
Agnisys is exhibiting at DVCon India 2026, bringing together the semiconductor industry to advance design and verification innovation. Visit us at Booth #34 to discover how Agnisys empowers engineering teams with streamlined workflows, intelligent automation, and AI-driven solutions that accelerate semiconductor development from specification to sign-off.
Tutorial Presentation:
Agnisys will also be part of the CDC-RDC Verification Standard 1.0 for Interoperable Abstract Model tutorial presentation.
Date & Time: September 1, 2026 | 02:00 – 03:30 PM
Visit: Track 2 – Grand Victoria A
Join the tutorial to learn more about the CDC-RDC Verification Standard 1.0 and its role in enabling interoperable abstract models for design and verification.
Explore live demonstrations of IDS-AI™ and IDS-NoC™, and discover how Agnisys is accelerating chip development from golden specification to sign-off through intelligent automation and Agentic AI.
IDS-AI™: From Specification to Sign-Off, Dramatically Faster
Agnisys will demonstrate IDS-AI™, the industry’s first agentic AI framework purpose-built for semiconductor development. By combining advanced AI reasoning with Agnisys’ correct-by-construction methodology, IDS-AI helps engineering teams accelerate the journey from golden specification to sign-off.
IDS-AI covers critical stages of the IP-to-SoC development and verification flow, including:
- Specification Checking & Verification– Validate specifications early, identify contradictions and gaps, and improve design accuracy before they become costly silicon issues.
- Assertion Generation– Automatically generate SVA assertions to strengthen design verification, improve coverage, and support formal-ready verification.
- Sequence Generation– Automatically generate UVM test sequences to simplify test development and reduce manual coding effort.
- IP/SoC Sign-off– Streamline verification workflows and provide a connected path from specification through IP and SoC verification to sign-off.
IDS-NoC™: Scalable Network-on-Chip Automation
Agnisys will also showcase IDS-NoC™, a solution designed to eliminate one of the most significant bottlenecks in modern SoC development—building an interconnect fabric that scales efficiently for AI accelerators, automotive systems, and multi-core processors without the timing and integration limitations of traditional crossbar architectures.
Instead of manually designing routers and network interfaces, engineering teams can automatically generate a complete, deadlock-free NoC fabric with virtually unlimited scalability across instances and interconnect blocks. Because the generated RTL is provided as open, plain-text SystemVerilog rather than a black-box implementation, teams retain complete visibility and control over their IP. The result is reduced integration effort, faster time-to-market, and an interconnect architecture designed to support increasingly complex SoC designs.