SEMICON India 2026
Agnisys is the Pioneer and Industry Leader in Golden Executable Specification Solutions™
Meet us at SEMICON India 2026 and discover how we automate the entire path from specification to silicon.
Schedule a meeting with our experts by completing the form on the right!

September 17-19, 2026
Yashobhoomi, New Delhi
Agnisys is exhibiting at SEMICON India 2026, where the global semiconductor ecosystem comes together to drive innovation and collaboration. Discover how Agnisys empowers engineering teams with AI-driven design automation, streamlined workflows, and intelligent solutions that accelerate semiconductor development from specification to sign-off. Visit us at Booth #H6533 to explore our latest technologies, experience live demonstrations, and connect with our experts.
Explore live demonstrations of IDS-AI™ and IDS-NoC™, and discover how Agnisys is accelerating chip development from golden specification to sign-off through intelligent automation and Agentic AI.
IDS-AI™: From Specification to Sign-Off, Dramatically Faster
Agnisys will demonstrate IDS-AI™, the industry’s first agentic AI framework purpose-built for semiconductor development. By combining advanced AI reasoning with Agnisys’ correct-by-construction methodology, IDS-AI helps engineering teams accelerate the journey from golden specification to sign-off.
IDS-AI covers critical stages of the IP-to-SoC development and verification flow, including:
- Specification Checking & Verification – Validate specifications early, identify contradictions and gaps, and improve design accuracy before they become costly silicon issues.
- Assertion Generation – Automatically generate SVA assertions to strengthen design verification, improve coverage, and support formal-ready verification.
- Sequence Generation – Automatically generate UVM test sequences to simplify test development and reduce manual coding effort.
- IP/SoC Sign-off – Streamline verification workflows and provide a connected path from specification through IP and SoC verification to sign-off.
IDS-NoC™: Scalable Network-on-Chip Automation
Agnisys will also showcase IDS-NoC™, a solution designed to eliminate one of the most significant bottlenecks in modern SoC development—building an interconnect fabric that scales efficiently for AI accelerators, automotive systems, and multi-core processors without the timing and integration limitations of traditional crossbar architectures.
Instead of manually designing routers and network interfaces, engineering teams can automatically generate a complete, deadlock-free NoC fabric with virtually unlimited scalability across instances and interconnect blocks. Because the generated RTL is provided as open, plain-text SystemVerilog rather than a black-box implementation, teams retain complete visibility and control over their IP. The result is reduced integration effort, faster time-to-market, and an interconnect architecture designed to support increasingly complex SoC designs.